Abstract: To address the challenges of nodal plane offset and heat dissipation in sandwich piezoelectric transducers, a cycloidal heat-dissipation fin design—optimized according to the nodal plane position—is proposed. The performance of three configurations—no fins, straight fins, and cycloidal fins—was compared through simulations and experiments. Simulation results show that cycloidal fins reduce the vibration amplitude by only 5.5% (compared with 20.7% for straight fins) and increase the resonant frequency error by merely 1.25% (compared with 1.66% for straight fins). Under a heat flux of 1000 W/m², the maximum temperature achieved with cycloidal fins is 2.76% lower than that with straight fins, and the average air velocity over the fin surface increases by 40.6%. Experimental verification shows that the simulation–experiment discrepancies in resonant frequency for all three configurations remain below 1.7%. The amplitude attained with cycloidal fins (18.33 μm) is close to that of the finless configuration (19.33 μm) and significantly exceeds that of the straight-finned configuration (15 μm). In natural cooling tests (cooling from 85 ℃ to 25 ℃) and heating experiments, the *cycloidal* fins improved thermal efficiency by 16.39% and 14.31%, respectively, compared with straight fins. This design achieves collaborative optimization of vibration performance and heat dissipation, providing an effective solution for developing high-performance piezoelectric transducers.