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基于散射噪声线性阵列模型的成像研究

Imaging study based on a linear array model with scattering noise

  • 摘要: 多晶材料中的晶粒散射噪声是影响超声阵列成像质量的关键因素。针对利用Voronoi图有限元模型在阵列检测中需逐阵元设置、计算效率低的问题,本文推导了含晶粒尺寸与数量的散射回波频率响应模型,结合阵列延迟聚焦与全矩阵数据采集机制,建立了散射噪声线性超声阵列检测模型。与Voronoi图模型相比,本模型虽无法模拟晶粒取向变化,但具备计算效率优势,更适用于阵列成像的系统性能分析。基于提出的模型分析了晶粒尺寸和激励频率变化对缺陷成像质量的影响,晶粒尺寸增大或检测频率升高均会增强散射噪声,导致成像质量下降,实验结果与模型预测一致。

     

    Abstract: Grain scattering noise in polycrystalline materials is a key factor affecting the quality of ultrasonic array imaging. Voronoi-diagram-based finite element models suffer from low computational efficiency in array inspections because each array element must be explicitly defined. To address this issue, this paper derives a scattering echo frequency response model that incorporates grain size and grain number. Based on this model, a linear ultrasonic array detection model for scattering noise is established by integrating array delay focusing with the full matrix acquisition (FMA) mechanism. Compared with the Voronoi diagram model, the proposed model cannot simulate variations in grain orientation; however, it offers a clear advantage in computational efficiency and is better suited for system-level analysis of array imaging. Using the proposed model, the effects of grain size and excitation frequency on defect imaging quality are analyzed. An increase in either grain size or detection frequency enhances scattering noise and degrades imaging quality. The experimental results are consistent with the model predictions.

     

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