Study of sawing force in ultrasonic vibration assisted monocrys-talline silicon dicing

In the monocrystalline silicon dicing process with ultra-thin diamond blade, a bigger sawing force can be generated, which leads to a big chipping damage. The rotary ultrasonic assisted machining with ultrasonic vibration can reduce cutting force in processing and obtain good machining precision. Thus this machining method has been more and more widely used in hard brittle materials processing. In order to reduce the sawing force in monocrystalline silicon dicing process, ultrasonic vibration is applied to the saw blade, which makes the blade having a radial vibration, to complete the dicing of monocrystalline silicon. The characteristics of ultrasonic sawing force are analyzed through the comparison of sawing force between ultrasonic dicing and non-ultrasonic dicing. The experimental results show that the sawing force generated by the ultrasonic assisted dicing is smaller than that by the non-ultrasonic dicing, and so is the chapping damage. It indicates that chipping of silicon wafer can be inhibited by the smaller force generated in ultrasonic machining.